Flash Memory turned 40 and we take this occasion to highlight some of the vendors in our linecard that offer flash memory.
In 2003, Winbond began mass production of 32Mb Flash memory chips with its 0.18um WinStack Flash process technology. After the successful introduction of Quad Serial Peripheral Interface NOR Flash in 2007, Winbond unveiled the first high data throughput QspiNAND in 2015. Continuously innovating, Winbond consistently releases new products to the market, improving the efficiency of electronic devices, promoting energy conservation, and contributing to carbon footprint reduction.
Low voltage for advanced processes
1.2V NOR Flash Memory is a new product line that Winbond is currently focusing on developing. As SoCs begin to adopt more advanced processes, the interfaces between Flash Memory and other peripheral ICs also tend to use lower voltages. 1.2V will be the next standard voltage after 3V and 1.8V.
Security and Power consumption
Code Storage Flash is widely used in most electronic products, and future electronic products will make significant contributions to human life through the adoption of Cloud, Edge AI, and various networking technologies. Therefore, the reliability of Flash Memory is a must-consider factor. How to achieve higher performance under controlled power consumption is the direction for the future.
One element is Secure Flash. It provides system protection by protecting the data with strong encryption and prevent boot code storage from accidental or malicious tampering. It helps to meet many new cybersecurity regulations that manufacturers need to comply with.
Move from miniaturization to better interfaces
In the past, miniaturization was the direction of Flash Memory development. However, due to the system's need for more efficient data access from Flash Memory, as well as the demand for better data integrity, the interface will become more complex.
More information at: www.winbond.com
